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CCZK-SF Magnetron sputtering coating machine

CCZK-SF Magnetron sputtering coating machine

 Product Information
Characterization
Chi-CCZK-SF magnetron sputtering machine, with a high deposition rate, the substrate temperature is low, the adhesion of the film, and can achieve a large area coating with respect to the conventional evaporation coating equipment, Chi-magnetron sputtering can get more excellent film density, uniformity and cohesion using the most advanced DC or MF magnetron sputtering power supply to meet the needs of different levels

Advanced high-speed low-temperature sputtering technology, greatly expanded the scope of application of Chi-CCZK-SF magnetic devices that can not heat or heat of the products provide quality solutions sputtering using Chi-innovation process, excellence, The EU adopted a comprehensive CE and ISO international quality management system certification;

Configuration

CCZK-SF magnetron sputtering equipment

Cavity structure: vertical front door, the front door horizontal.

Material material: cavity made of SUS304 stainless steel or carbon steel

Vacuum system: diffusion pump (optional molecular pump) + roots pump mechanical pump + maintain pump (otherwise cryogenic pump systems to choose from)

Sputtering targets: central cylindrical target, planar target, target, etc. twin

Magnetron power: it can be equipped with a DC or MF magnetron sputtering power

Rotation system: frequency control, combined rotation and revolution, according to customer requirements for product and design

Film structure: single-layer film, multilayer film

Gas control: Gas flow control device integrated touch operation control

HMI: PLC intelligent control + full-color touch screen HMI

Operating mode: logic of automatic mode, semi-automatic mode, manual mode

Intelligent Control: PLC intelligent control + HMI full-color touch human-machine interface, to achieve automatic control

Alarm and protection: abnormal situation alarm, and implement the appropriate protective measures.

Other technical parameters:

Ultimate vacuum: 5.0 × 10-4Pa

Pumping speed: 5.0 * 10-2≤5min

Hydraulic flow rate ≥0.2Mpa 3m3 / h; temperature ≤25 ℃; Pressure: 0.4-0.8Mpa;

Remarks:

General Specifications:

Φ1000mm * H1200mm, Φ1400mm * H1600mm, Φ1200mm * H1500mm,

Φ1800mm * H2000mm, Φ2000mm * H2200mm

Vacuum chamber size or device configurations according to customer requirements for customized products and special process

Application
High decorative film for plating, alloy layer and the like. Advanced high-speed response low-temperature sputtering technology, the success of its high-speed growth capacity and excellent film uniformity of the film density, widely used in plastic cutlery, cell phone case, sanitary ware, car wheels, metal jewelry and signs, and other coatings. Also sputtered plastic products, ceramics, mosaics, resin, crystal glass products


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